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Solar photovoltaic industry
 
Solution for wafer cutting   
Wafer cutting is a key part of the solar cell manufacturing process,Our metal binder wire saw powder, resin binder diamond wire saw powder and related plating products have a wealth of application cases,We  can provide professional solutions to meet the high-efficiency, long-life processing requirements of line cutting, wafer cutting and other related efficient wafer cutting.
Perfect Cutting surface , less cutting scratches on the surface. Besides, multi-size abrasive particles with a combination of various binders can meet different processing needs.
 
Diamond on silicon wafer thinning and polishing solution
According to the customer's different processes and end-application needs,we cacn Provide vitrified bond and resin bond diamond series, And we can also provide customized products based on the strength and crystal form. Coarse grinding wheel using coarse diamond, fine grinding wheel with fine particles of diamond. Resin binder for semi-fine grinding, grinding processing. Customer can choose different diamond binder according to the processing technologies request.
 
 
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ZHENGZHOU BEST SYNTHETIC DIAMOND CO., LTD
Tel:0371-56587397
Fax:0371-56587393
Phone:86+15036077585
WeChat:15036077585
E-mail:Nancy@bsdar.com
Add:No. 89 science Avenue, West Development Zone, Zhengzhou, Henan